Beyond Limits

T-Link®

T-Link^® is our advanced engineering thermoplastic adhesive for ultimate performance and processability.

WHAT IS T-LINK?

AN ENABLING TECHNOLOGY

T-Link^®, our advanced engineering thermoplastic adhesive, combines superior adhesion with the processing characteristics of a thermoplastic.

To meet a long-existing industry need, T-Link^® does not require refrigeration or special handling and can be consolidated into a composite structure quickly. Due to its thermoplastic nature, T-Link^® conforms to deep-drawn parts for producing irregularly shaped components.

Offered in several unique forms and melt viscosities, T-Link^® is custom-engineered to suit your manufacturing process and substrates.

Bond/debond capabilities with superior adhesion
Processing characteristics of a thermoplastic
Long shelf life, no refrigeration required
Dry to the touch & no odor

The T-Link® Difference

SUPERIOR ADHESION

High strength and rigidity

PROCESSING CHARACTERISTICS OF THERMOPLASTIC POLYMERS

High strain-to-failure
ratio of up to 40%

DISCOVER

processability & performance

Cost and Time Savings

Dry to the touch for easy processing
Strategic use reduces waste in processing compared to wet layup systems
Does not require refrigeration
Long shelf life
Reduces layup and process time resulting in lower labor costs

Enhanced Structural Rigidity

A matrix material with a high elastic modulus that remains impact-resistant when consolidated into continuous fiber composites
Can be co-processed with materials such as glass, aramids, and some UHMW-PE to increase performance and rigidity

Reduced Weight and Profile

Some materials created with  T-Link^® allow for a lower ply count, potentially reducing weight and profile thickness

Flexibility in Design

Transparent, pigmentable, and recyclable
Can be co-processed with dissimilar materials
Super bond strength to a wide range of substrates
Lower processing temperatures won't damage natural fibers

PRODUCT PORTFOLIO

Custom-engineered solutions

T-Link^® is available in a range of melt viscosities, enabling a tailor-made solution in multiple forms*, including pellets, films, yarns and monofilaments, and micropellets.

* Some T-Link^® forms are developmental technologies.

Pellets

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Pellets

T-Link^® comes in pellet form and is typically used in other formulations as a toughener. Our resin is unique in that it has a high strain-to-failure and exhibits excellent adhesive properties.

These attributes make T-Link^® pellets an ideal solution for composite manufacturers that are seeking a highly customizable composite reinforcement that will be strong and thermoformable.

Micropellets

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Micropellets

T-Link^® in micropellet form can be used as binder resin for the textile and non-woven industry, or as the particulate heat-activated adhesive for composite manufacturing.

Our resin is unique in that it has a high strain-to-failure and exhibits excellent adhesive properties. The micropellets have a particle size distribution of 600 – 800 microns.

Film

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Film

T-Link^® film is a dry-to-the-touch, engineered thermoplastic adhesive. It does not disrupt intended color and allows for light transmission where applicable.*

T-Link^® film can be processed with traditional press equipment, has a short cycle time for
bonding, does not require refrigeration, and has a long shelf life. Additionally, it has no odor and is typically paintable.

*Not intended for exterior UV exposure.

YARN & MONOFILAMENTS

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YARN & MONOFILAMENTS

Our novel yarn and monofilaments are used as a method to introduce this resin to create a dry, drapable composite fabric that is ready for consolidation.

T-Link^® yarn and monofilaments can effectively be co-woven or sewn into textile applications to make a dry thermoplastic composite with targeted and precise control of resin content.

POTENTIAL APPLICATIONS

Enhanced durability and performance for
lightweight composite structures

T-Link^® can be used to create lightweight, highly customizable composite structures that empower performance with processibility in a wide range of markets and potential applications.

RESOURCES