T-Link™ Technology -
T-Link™ is our advanced engineering thermoplastic resin that combines superior adhesion with the processing characteristics of a thermoplastic.
- High-stiffness matrix material that remains impact resistant when consolidated into continuous fiber composites
- Can be co-processed with ballistic materials such as glass, para-aramids, and UHMW-PE to increase performance and rigidity
- Allows for materials with lower ply count, hence reducing weight and profile thickness
- Does not require refrigeration
- Reduces the layup and process time resulting in lower labor costs
- Lower processing temperatures won’t damage natural fibers
- Transparent, pigmentable, and recyclable
- Can be co-molded with dissimilar materials
- Superior bond strength to a wide range of substrates
Create stronger reinforcement
T-Link™ comes in pellet form and is both injection moldable and extrudable. The recyclable resin is typically used in other formulations as a toughener. T-Link™ is unique in that it has a high strain-to-failure and exhibits excellent adhesive properties.
These attributes make T-Link™ resin an ideal solution for composite manufacturers that are seeking a highly customizable composite reinforcement that will be strong and not suffer from brittle failure.
Dry-to-the-touch for easy handling
T-Link™ film is a dry-to-the-touch, engineered thermoplastic adhesive that demonstrates 99 percent optical clarity. As a result, it does not disrupt intended color and allows for light transmission where applicable.
T-Link™ film can be processed with traditional press equipment and provides a short cycle time for bonding. It does not require refrigeration and has a long shelf life. Additionally, it has a low odor and is both paintable and pigmentable.
Reinforcement for textile applications
The novel T-Link™ yarn is used as a vehicle to introduce a resin into an advanced composite fabric in order to achieve lightweight, high strength, and toughness. It can effectively be co-woven or sewn into textile applications to make a dry thermoplastic composite with targeted and precise control of resin content.
T-Link™ yarn allows for ease of use and reduces the time and labor involved in applying a wet resin system and the subsequent curing of the thermoset resin.
Create stronger composite reinforcement
You can use T-Link™ in powder form as binder resin for textile and nonwoven industry, or as the particulate heat activated adhesive for composite manufacturing. Our resin is unique in that it has a high strain-to-failure up to 40 percent and exhibits excellent adhesive properties.
The recyclable T-Link™ powder offers a particle size distribution of 200-450 microns with an average of 300 microns and has a long shelf life.
Lightweight adhesive layer for stability
T-Link™ fiber veil is a dry-to-the-touch, engineered thermoplastic adhesive that demonstrates 99 percent optical clarity, therefore, does not disrupt intended color and allows for light transmission where applicable.
T-Link™ fiber veil has a lower areal weight than T-Link™ film, but also offers a short cycle time for bonding, does not require refrigeration, and has a long shelf life. The fiber veil can be used as a stabilizing layer for unidirectional tapes.
Thin and lightweight selective reinforcement
T-Link™ can be used as the matrix resin that impregnates with the fiber to produce unidirectional composites/tapes for selective reinforcement. It is compatible with a variety of structural reinforcement fibers, such as aramid, glass, carbon, etc.
The composite/tape can be used as a selective reinforcement to improve tensile strength and stiffness in one direction while adding minimum thickness and weight.
Download L&L Products resources on T-Link™ and find out more about the enabling technology that can help you go beyond limits.
October 16-19, 2022
CAMX 2022 (the Composites and Advanced Materials Expo)
We are exhibiting at the Composites and Advanced Materials Expo (CAMX) in Anaheim, California on October 17-20, 2022.Read more
October 09-11, 2022
Association of the United States Army (AUSA) Annual Meeting and ExpositionRead more
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